New Product Introduction Sessions

IMG_3101

Organizer will hold an exhibitors’ “New Product Introduction” at the exhibition site. The event will focus on new equipment, new technology, electroplating, medicine, materials, and other related issues.

The NPI will run from the afternoon of Oct. 21th to the afternoon of Oct. 23th. SHAN HSIN RONG TECHNOLOGY CO, LTD、Matsuda Sangyo Co., Ltd.、TAIFLEX Scientific Co., Ltd.、Taiwan Union Technology Corporation、TAIWAN UYEMURA CO., LTD.、MELTEX TAIWAN INC.、MacDermid Chemical Taiwan Ltd.、JCU Taiwan Corporation、Stella Technology Co.,LTD、Akrometrix,LLC、Assoma Inc.、Epotek Electronics co.,LTD、AbleTek Inc.、SYNPOWER Co., Ltd.—14 manufacturers with a total of 18 sessions will release new products with the latest cutting-edge technology. This provides exhibitors a platform for releasing new products and technologies. Buyers are welcome to visit and get more information.

NPI1NPI1

DateTimeNPI
(K-227)
Subject
10/2611:00 - 11:40美商羅捷士股份有限公司台灣分公司
Rogers Taiwan Inc

Booth number:K-008
RO4000®板材CAF測試
Measuring the CAF Resistance of RO4000® Materials

《限制同業入場》
《Off-Limits to Competitors》
10/2613:00 - 13:40奧野製藥工業株式會社
OKUNO CHEMICAL INDUSTRIES CO., LTD.
Booth number:K-1329
TOP LUCINA Series該製程是為了提供給客戶多種的應用需求,本公司精心研發出一系列適用於電子線路形成的硫酸銅添加劑
Introduce our additives for copper sulfate plating bathes, TOP LUCINA series, that can satisfy various needs for electronic circuit formation.

《限制同業入場》
《Off-Limits to Competitors》
10/2614:00 - 14:40台燿科技股份有限公司
Taiwan Union Technology Corporation

Booth number:K-631
5G應用之新型高階基板材料
New Advanced Laminate Materials for 5G Applications

《限制同業入場》
《Off-Limits to Competitors》
10/2615:00 - 15:40亞智科技股份有限公司
Manz Taiwan Ltd.

Booth number:K-1413
在線式高精度自動分析管理添加儀-輕薄、簡便且易於攜帶及維護
Inline automatic analysis device with good portability and high accurate analysis to control the liquid supply automatically

《限制同業入場》
《Off-Limits to
Competitors》
10/2711:00 - 11:40鼎展電子股份有限公司
FLEX TEK CO., LTD.

Booth number:I-406
濺鍍薄銅材料的發展與FPC產品應用
Application of Thin Cu Film Fabricated by Sputtering Process for New FPC Product

《限制同業入場》
《Off-Limits to Competitors》
10/2713:00 - 13:40台灣傑希優股份有限公司
JCU Taiwan Corporation

Booth number:K-613
對應MSAP 細線路化的高性能低成本製程提案
High performace and low cost process for fine pattern application of MSAP

《限制同業入場》
《Off-Limits to Competitors》
10/2714:00 - 14:40台灣美錄德股份有限公司
Meltex Taiwan Inc.

Booth number:K-014
SAP/M-SAP製程適用的超細線路用DFR剝離劑、以及銅柱用厚膜之DFR剝離劑
Introduction of DFR Stripper for Ultra-fine pattering SAP & M-SAP and Thicker DFR Stripper for Copper pillar bump

《限制同業入場》
《Off-Limits to Competitors》
10/2715:00 - 15:40奧野製藥工業株式會社
OKUNO CHEMICAL INDUSTRIES CO., LTD.

Booth number:K-1329
TOP UFP Process製程適用於L/S=2/2μm超細微線路的形成及其最終表面處理製程
Ultra-micro pattern formation of line and space 2 to 2μm and the exclusive final surface treatment process for the ultra-micro patterns (TOP UFP PROCESS)

《限制同業入場》
《Off-Limits to Competitors》
10/2811:00 - 11:40日商松田產業股份有限公司台灣分公司
Matsuda Sangyo Co., Ltd., Taiwan Branch

Booth number:K-630
微細電路適用之無氰化鍍金製程
Non-cyanide electroless gold plating process for thinner and smaller PCBs

《限制同業入場》
《Off-Limits to Competitors》
10/2813:00 - 13:40亞太國際電子器材股份有限公司
Teltec Semiconductor Pacific (Taiwan) Limited
Akrometrix, LLC

Booth number:I-1007
高溫陰影疊紋表面形貌量測系統之進化發展
The Evolution of Thermal Shadow Moiré Metrology

《限制同業入場》
《Off-Limits to Competitors》
10/2814:00 - 14:40台灣上村股份有限公司
TAIWAN UYEMURA CO., LTD.

Booth number:K-621
新型高速電鍍銅柱用添加劑
New type of additive for High speed Cu plating

《限制同業入場》
《Off-Limits to
Competitors》
10/2815:00 - 15:40奧野製藥工業株式會社
OKUNO CHEMICAL INDUSTRIES CO., LTD.

Booth number:K-1329
TOP SAPINA Process製程適用於先孔工法形成TH的PI上形成Ni晶粒層
TOP SAPINA PROCESS, wet process by depositing nickel seed layer on polyimide films with through holes

《限制同業入場》
《Off-Limits to Competitors》

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