Technology Symposium and Research and Development Announcement of the Alliance of Micro- and Nano-Metallization Technology

National Chung Hsing University (NCHU) and Taiwan Printed Circuit Association (TPCA) will jointly hold “Technology Symposium and Research and Development Announcement of the Micro- and Nano-Metallization Process Technology Alliance”. Dr. Wei-Ping Dow, the Tenured Distinguished Professor of NCHU, will host the symposium.
In this symposium, the research team of Dr. Dow will publish their latest technologies, and the alliance will invite international companies, to give lectures in order to support and enhance technology competitiveness and process capability of the related electronic industry.

Excellent speakers and abundant lecture content will be expected, such that the symposium will certainly be brilliant!

Date
October 26 FRI

Time
09:30-16:00

Venue
Taipei Nangang Exhibition Center 4th Floor, Room 401

Sign up
https://goo.gl/CTFYXH

Contact
Ms. Pei-Ying Yang /  Ms. Chia-Wen Lin
Tel: 04-22840510 #905
Email:evayang@dragon.nchu.edu.tw  /  cwlin@dragon.nchu.edu.tw