Exhibitors List of Fine Line
Fine Line
電路板或IC載板的線路設計越來越細以增加佈線密度，一般電路板線寬/距在75/75μm以下即可稱為細線，類載板(SLP)目前需求30μm以下，IC載板需求則已到10μm以下。也因此衍生不同的細線技術，如mSAP製程、LDI設備製程等。
Following the requirement of PCB’s circuit design or IC carrier boards to become thinner to increase the wiring density, the general line width/distance of the circuit board of less than 75/75μm is known as a fine line. The current SLP’s (substrate-like PCBs) require a line width of less than 30μm, and less than 10μm for those of the IC carrier boards,. The trend has generated different fine line technologies, such as mSAP process, LDI (laser direct imaging) process, etc.