Exhibitors List of mSAP
Modified Semi-additive Process (mSAP)
一般HDI電路板以極薄銅箔做疊層壓合，或一般銅箔壓合後做經減銅製程，後續再進行影像轉移、電鍍銅及閃蝕製程，以製作更細線路。化學銅和FR4基材間的附著力不佳，因此借助銅箔粗面和基材結合產生較大拉力，但需控制此外加銅箔厚度越薄越好，才能製作更細線路。
To yield a finer circuit, the general HDI circuit board is laminated with an extremely thin copper foil, or the laminated copper foil is allowed to go through a copper reduction process. The follow-up processes are image transferring, copper plating, and flash etching. As the adhesion between the chemical copper and FR4 substrate is not good, it needs to generate a high tensile force through the integration of the copper foil’s rough surface and the substrate. It is still necessary to control the thickness of the copper foil to be as thin as possible to make a finer line.