Exhibitors List of Microvia
The interconnected vias among the layers of a multilayer HDI board are referred to as microvias. The early IPC definition of a microvia is less than 0.15mm. In 2013, a new definition was announced: When the via’s aspect ratio (thickness to diameter ratio) is 1:1, it is called a microvia. Currently, the laser processing of microvias has become mainstream.