Exhibitors List of Additive Process
全加成法 Additive Process
Unlike the general method of producing a circuit on a copper foil substrate, AP involves producing a circuit on an insulating substrate through a chemical deposition method. As no copper foil is used in this method, the manufacturing process is short, generates less wastewater, uses less water, is environmentally friendly, and has other advantages because copper is only deposited on the circuit. It can also yield a circuit with very accurate cross-sectional geometry.