Exhibitors List of SAP
Semi-additive Process (SAP)
It is currently the primary process of IC carrier boards, by chemically depositing the metal on the surface of an insulating substrate. The subsequent processes are lithography, electroplating, flash etching, …etc. to produce the circuit. As the line width requirement of IC carrier boards is gradually lowered to 10μm, it is quite different from the conventional circuit board process. The IC carrier board is initially laminated with an ABF substrate, which is followed by chemical copper surface deposition, lithography, copper plating on the circuit, and etching the thin chemical copper layer through a non-differential flash etching method. Due to the small amount of micro-etching, it has little effect on the thickness and geometry of the circuit.