Exhibitors List of mSAP
Modified Semi-additive Process (mSAP)
To yield a finer circuit, the general HDI circuit board is laminated with an extremely thin copper foil, or the laminated copper foil is allowed to go through a copper reduction process. The follow-up processes are image transferring, copper plating, and flash etching. As the adhesion between the chemical copper and FR4 substrate is not good, it needs to generate a high tensile force through the integration of the copper foil’s rough surface and the substrate. It is still necessary to control the thickness of the copper foil to be as thin as possible to make a finer line.