5G Next New Product Introduction

今年新產品發表會聚焦5G最新發展與應用,知名國際大廠包含台燿科技、台灣傑希優、深圳市金洲精工、萬億、奧野製藥、台灣杜邦、台灣美錄德、協技科技、連達國際、美商羅捷士等廠商皆將揭露公司5G發展技術。

Every year there are many companies reveal all the latest new products in hopes to draw interest from distributors, dealers and prospective customers at TPCA Show.

主題包含:5G無線基礎設施市場PCB資料的發展趨勢、5G驅動下的通訊板鑽孔解決方案、5G新材料的金屬化先進製程、實現5G產品線路需求的藥水提案、TOP LUCINA GAP 是最合適於5G用高速通訊且高密度印刷電路板的填孔硫酸銅電鍍添加劑、5G高頻細線路下,兼顧銅面平整性的新世代選擇性蝕刻藥水、高頻傳輸軟性電路板材料、連達國際 5G電子材料解決方案等,歡迎10/23-25至南港展覽館I-030攤位現場聆聽發表會。

Most manufacturing companies participate in one or more of the various product expos held around the globe. Companies are continually improving existing products or introducing the latest “all new” models. What many people do not see or even think about is all the work that was involved in the design, development and introduction of the new products.
There are over 20 sessions at TPCA Show about 5G products, welcome and get new technology with us.

【Date】October 23~25 11:00-16:00
【Location】 I-030
【Window】Jessie@tpca.org.tw

/ October 23 /
Company Time Booth No. Competitor Stop Topic
深圳市金洲精工科技股份有限公司
Shenzhen Jinzhou Precision Technology Corp.
11:00-11:40 K-313 Yes 5G驅動下的通訊板鑽孔解決方案
Drilling solutions for 5G
台燿科技股份有限公司
Taiwan Union Technology Corporation
13:00-13:40 K-631 Yes 5G應用之新型高頻高速基板材料
New High Speed & High Frequency Laminate Materials for 5G applications
連達國際股份有限公司
Takewin International Co., Ltd.
14:00-14:40 J-1103 Yes 連達國際 5G電子材料解決方案
Takewin international material solutions for 5G electronics
萬億股份有限公司
TRIALLIAN CORPORATION
15:00-15:40 K-419 Yes 因應5G PCB嚴格規格之脈衝電鍍工程革新突破- Agesflo®pr system
An innovative pulse-reverse copper plating system for 5G PCB
台灣杜邦股份有限公司
DUPONT TAIWAN LTD.
16:00-16:40 K-712 Yes 應用於5G的下世代高多層板直流電鍍解決方案 “ELECTROPOSITTM 1600”
Next Gen. DC Plating Solution “ELECTROPOSITTM 1600” for High Layer Counts for 5G Application.

/ October 24 /
Company Time Booth No. Competitor Stop Topic
協技科技股份有限公司
HAJIME CORPORATION
10:10-10:50 K-921 Yes 5G高頻傳輸軟性電路板材料
5G FPC Material For High Frequency
美商羅捷士股份有限公司台灣分公司
Rogers Taiwan Inc.
11:00-11:40 K-008 Yes 5G無線基礎設施市場PCB資料的發展趨勢
TREND AND DEVELOPMENTS IN PCB MATERIALS FOR 5G WIRELESS INFRASTRUCTURE MARKET
台灣美錄德股份有限公司
Meltex Taiwan Inc.
14:00-14:40 K-625 Yes 5G高頻細線路下,兼顧銅面平整性的新世代選擇性蝕刻藥水
The applications of high frequency and fine line in 5 G, new generation choice of Selective Etching Chemicals with the uniformity of Cu surface
台灣傑希優股份有限公司
JCU TAIWAN CORPORATION
15:00-15:40 K-929 Yes 實現5G產品線路需求的藥水提案
New Chemicals for achieve your 5G reality
奧野製藥工業株式會社
OKUNO CHEMICAL INDUSTRIES CO.,LTD.
16:00-16:40 K-730 Yes TOP LUCINA GAP 是最合適於5G用高速通訊且高密度印刷電路板的填孔硫酸銅電鍍添加劑
Acid Copper Plating Additive for Via Filling, Developed for Interposers and HDI PWB for 5G Applications: TOP LUCINA GAP

/ October 25 /
Company Time Booth No. Competitor Stop Topic
萬億股份有限公司
TRIALLIAN CORPORATION
11:00-11:40 K-419 Yes 滿足5G規格之全方位鍍銅製程-SF50
An innovative copper plating electrolyte to meet
萬億股份有限公司
TRIALLIAN CORPORATION
14:00-14:00 K-419 Yes 5G 新材料之先進金屬化製程-nano graphite
The innovate metallization process