STANDARD VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
Model: SVCP
Category: Electrolytic Plating Equipment
Exhibitor: APPLIED EQUIPMENT LIMITED
Booth No: TBA
Characteristic
● Modular design fulfill customers’ requirement ● Apply to panel plating ● Fully auto. loading/unloading ,save manpower ● No auxiliary frame and jig to be used for board thickness 0.134 to 2.0 mm during production ● Uniform distribution of plating quality ● Remarkable throwing power of high aspect ratio for through hole, blind via , via fill and TH fill plating ● Auto online chemical stripping ● Easy operation and maintenance
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