STANDARD VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
Model: SVCP
Category: Electrolytic Plating Equipment
Exhibitor: APPLIED EQUIPMENT LIMITED
Booth No: TBA
Characteristic
● Modular design fulfill customers’ requirement ● Apply to panel plating ● Fully auto. loading/unloading ,save manpower ● No auxiliary frame and jig to be used for board thickness 0.134 to 2.0 mm during production ● Uniform distribution of plating quality ● Remarkable throwing power of high aspect ratio for through hole, blind via , via fill and TH fill plating ● Auto online chemical stripping ● Easy operation and maintenance
Other Products
-
Contactless RTR Electroless Platng Line
-
Multilayer Inductive Bonding
-
Digital Microscope with Laser-based Elemental Analyzer
-
PCB automatic inspection production line with Online PCB warping and straightening machine / warpage inspection machine / hole inspection machine
-
Auto Brushing Machine
-
Film Coating Pre-treatment
-
UVmount Curing Machine
-
Oil-less Rocking Piston Type Vacuum Pumps
-
Laser 3D Inspection System
-
Switching Power Supply
Products you may be interested in
-
VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT (DOUBLE TYPE)
-
DOUBLE TRACK VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
-
Vertical Continuous Copper Plating Equipment
-
U-TURN VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
-
U-TURN VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT(DOUBLE TYPE)
-
pe- pulse reverse rectifier
-
Immerison Bus Bar
-
Anode basket
-
VCP on-line rack monitoring system
-
pe- DC power supply
-
PVC/PP TRUE UNION BALL VALVE
