Planarization Grinding Machine

 

Model: 1 vs 5 Planarization Grinding Machine

Category: Grinding Machine

Exhibitor: GALLANT PRECISION MACHINING CO., LTD.

Booth No: TBA

 

Characteristic

 

1. Automatic dressing function: It can automatically measure the difference of wheel after dressing and compensation. 2. Automatic thickness measurement function: It can be set up for multipoint measuring and recording, and then feedback to the grinding process to make the compensation. 3. Central water supply system can monitor the water level, the flow rate and pressure of coolant water. This is helpful for controlling the quality of grinding. 4. Integration of automation that can automatically feed from LD / ULD, and it can also support the AGV、RGV and Automated Storage system of factory. 5. The equipmentincludes the IN Line and multi-unit of grinding system, it can complete the complex grinding process at the same time. 6. The flexible human-machine interface is more conductive for field personnel operating. 7. It can be applied to the grinding of IC substrate and Panel fan-out.

 

Other Products

 

• 

  Automatic Sample-Cutting Machine (QY22)

• 

  FC CSP Bump Inspection CSP

• 

  FPC PCB-Sputer coating

• 

  Flexible PCB Laminating

• 

  Plasma Etch- plasma treatment systems

• 

  Direct Imaging Systems

• 

  X-RAY Inspection Equipment

• 

  LPKF StencilLaser

• 

  Processing examples:FCCL(ROLL)

• 

  PCB AVI

 

 

 

Back