Vertical Continuous Copper Plating Equipment

 

Model: VCP

Category: Electrolytic Plating Equipment

Exhibitor: APPLIED EQUIPMENT LIMITED

Booth No: TBA

 

Characteristic

 

*Apply to panel and pattern plating process *Fully auto. loading/unloading, save manpower *No auxiliary frame and jig to be used for board thickness 0.06 to 3.2 mm during production *Uniform distribution of plating quality *Remarkable throwing power of high aspect ratio for through hole, blind via and via fill plating *Modular design can fulfill customers’ requirement *Auto. online chemical stripping *Easy operation and maintenance

 

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