Vertical Continuous Copper Plating Equipment
Model: VCP
Category: Electrolytic Plating Equipment
Exhibitor: APPLIED EQUIPMENT LIMITED
Booth No: TBA
Characteristic
*Apply to panel and pattern plating process *Fully auto. loading/unloading, save manpower *No auxiliary frame and jig to be used for board thickness 0.06 to 3.2 mm during production *Uniform distribution of plating quality *Remarkable throwing power of high aspect ratio for through hole, blind via and via fill plating *Modular design can fulfill customers’ requirement *Auto. online chemical stripping *Easy operation and maintenance
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pe- pulse reverse rectifier
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pe- DC power supply
