Vertical Continuous Copper Plating Equipment

Model: VCP

Category: Electrolytic Plating Equipment

Booth No: TBA

Characteristic

*Apply to panel and pattern plating process *Fully auto. loading/unloading, save manpower *No auxiliary frame and jig to be used for board thickness 0.06 to 3.2 mm during production *Uniform distribution of plating quality *Remarkable throwing power of high aspect ratio for through hole, blind via and via fill plating *Modular design can fulfill customers’ requirement *Auto. online chemical stripping *Easy operation and maintenance