VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT (DOUBLE TYPE)
Model: VCP(DT)
Category: Electrolytic Plating Equipment
Exhibitor: APPLIED EQUIPMENT LIMITED
Booth No: TBA
Characteristic
*Apply to panel and pattern plating process *Double track design increase double capacity but occupy less space *Use six axis robot with CCD to detect edge of panel accurately *Unloading M/C to unload panel automatically to save manpower *No auxiliary frame and jig to be used for board thickness 0.06~ 1.6 mm during production *Uniform distribution of plating quality *Remarkable throwing power of high aspect ratio for through hole, blind via , via filling and through hole filling process *Modular design can fulfill customers’ requirements *Auto. chemical online copper stripping *Easy operation and maintenance
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