U-TURN VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT(DOUBLE TYPE)

Model: UVCP(DT)

Category: Electrolytic Plating Equipment

Booth No: TBA

Characteristic

*Specially for SAP and MSAP process of IC substrate i.e. Flip Chip BGA, CSP, Flip Chip, CSP *Use one size frame to assist production to ensure smooth transportation without touching *panels and better quality for pattern. *Use six axis robot with CCD to detect edges of panels accurately *Unloading M/C to unload panel automatically to save manpower *For extra fine pattern: LW/LS:12/9 μm *Uniform distribution of plating quality *Remarkable throwing power for extra fine pattern on thin board, blind via filling and *through hole filling. *Modular design can fulfill customers’ requirements. *Auto. online chemical stripping. *Easy operation and maintenance