U-TURN VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT(DOUBLE TYPE)
Model: UVCP(DT)
Category: Electrolytic Plating Equipment
Exhibitor: APPLIED EQUIPMENT LIMITED
Booth No: TBA
Characteristic
*Specially for SAP and MSAP process of IC substrate i.e. Flip Chip BGA, CSP, Flip Chip, CSP *Use one size frame to assist production to ensure smooth transportation without touching *panels and better quality for pattern. *Use six axis robot with CCD to detect edges of panels accurately *Unloading M/C to unload panel automatically to save manpower *For extra fine pattern: LW/LS:12/9 μm *Uniform distribution of plating quality *Remarkable throwing power for extra fine pattern on thin board, blind via filling and *through hole filling. *Modular design can fulfill customers’ requirements. *Auto. online chemical stripping. *Easy operation and maintenance
Other Products
-
V-Bond Treatment M/C
-
Back-Up Board
-
Full Automatic Exposure System for High
-
Pretreatment for SR
-
IC Substrate(PBGA/CSP/FCCSP)-Sputer coating
-
Roll to roll inspection system
-
PCB clean machine
-
IC Substrate AFVI
-
Small Size Auto Unloader
-
Automatic Hot Air Conveyor Oven(Rack type)
Products you may be interested in
-
Vertical Continuous Copper Plating Equipment
-
VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT (DOUBLE TYPE)
-
STANDARD VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
-
DOUBLE TRACK VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
-
U-TURN VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
-
Anode basket
-
VCP on-line rack monitoring system
-
pe- pulse reverse rectifier
-
pe- DC power supply
-
Immerison Bus Bar
