IC Substrate AFVI

Model: M-Class

Booth No: TBA

Characteristic

High Performance Magazine/ stack in and out inspection. High Resolution 12K B&W TDI line scan is applied in Gold, PWB, SR inspection High Accuracy Applied to embedded substrate, providing efficient and precise inspection. Inspected Objects Suitable for SiP/ PBGA/ CSP/ RF module/ FC CSP/ SD & MSD Card. Inspection product size : Magazine：(W) 55~100 mm(L) 210~260mm Stack：(W) 25~150 mm(L) 90~280 mm