Multilayer Inductive Bonding
Model: Bonding 168, Bonding 200, Bonding 211
Category: Rigid Board
Exhibitor: TAIWAN KONG KING CO., LTD. (TKK)
Booth No: TBA
Characteristic
By inductive-magnetic heating system, there's no limit on layer-count. The most advanced 8G induction bonding system is faster in heating rate 50% more than previous generation with a low-power consumption.
Other Products
-
Multilayer Bonding System
-
Horizontla Atmospheric-Presure Plasma Equipment
-
Teflon
-
Crystallized 300ohm Resistive ITO FILM
-
日本 SANSO PMD-641 耐酸鹼泵浦
-
FVCP
-
MicroCraft InkJet Printer
-
Tin Oxide
-
TETRA 30 GERMANY DIENER PLASMA FULLY AUTOMATIC INLINE SYSTEM
-
SANSO DC PUMP (replace IWAKI RD-05HCV24)
Products you may be interested in
