Multilayer Inductive Bonding
Model: Bonding 168, Bonding 200, Bonding 211
Category: Rigid Board
Exhibitor: TAIWAN KONG KING CO., LTD. (TKK)
Booth No: TBA
Characteristic
By inductive-magnetic heating system, there's no limit on layer-count. The most advanced 8G induction bonding system is faster in heating rate 50% more than previous generation with a low-power consumption.
Other Products
-
PCB Legend Printing Machine
-
日本 SANSO PMD-2573 耐酸鹼泵浦
-
High-speed dual-axis Tray inspection machine
-
Automatic Optical Inspection
-
Foaming Buff
-
Horizontal Desmear Line
-
Vacuum Holes Plugging Machine
-
High Precision Routing Machine
-
Adhesive Roll - PP Synthetic Paper Series
-
PCB Metallurgical Microscope
Products you may be interested in
