Cedatec Multilayer Inductive Bonding
Model: Bonding 168, Bonding 200, Bonding 211
Category: Rigid Board
Exhibitor: TAIWAN KONG KING CO., LTD. (TKK)
Booth No: TBA
Characteristic
By inductive-magnetic heating system, there's no limit on layer-count. The most advanced 8G induction bonding system is faster in heating rate 50% more than previous generation with a low-power consumption.
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