Taiwan Build-Up Film
Model: TBF
Exhibitor: WaferChem Technology
Booth No: TBA
Characteristic
● Independent research and manufacture in Taiwan ● Copper can chemical plating on the build-Up film which can replace traditional copper foil substrate. ● Can reduce the thickness of substrate, solve the difficulty of laser drilling on BT substrate. ● Excellent adhensive performance, chemical resistance and grinding material. ● Low CTE to reduce package warpage ● Low Dk & Df ● Preservation condition better than Japan Brand (0-5 degreeC 6 Months ) ● Eco-friendly, do not contain toluene (Pass RoHS) ● Lead time short and sufficient capacity
Other Products
-
JTR Lead-Free Nitrogen/Hot Air Reflow Oven
-
Auto-Alignment UV-LED Exposure Units(for inner layer / outer layer)
-
Delta-String Inverter
-
Reduction Solution Cu
-
Relay Module
-
Desmear & PTH Line
-
Vacuum and Pressing Machine of Composite Material Moulding
-
Rubber Roller
-
Back-drill plate thickness measurement machine
-
YC-PAD HOLDER
