Backside Protection Film

 

Model: BPT

Category: IC Packaging

Exhibitor: WaferChem Technology

Booth No: TBA

 

Characteristic

 

● Independent research and manufacure in Taiwan ● Application for WLCSP & Fan-Out process, can reduce the defects caused by cutting the wafer. ● Excellent laser marking quality. ● Excellent adhesion performance with metal . ● Excellent heat dissipation. ● Application for Infrared (IR) Transmission inspection of wafer backside. ● Control wafer warpage for RDL process. ● Can Customize film feature i.e. magnetic, transparent...etc. ● Eco-friendly, do not contain toluene ● Competitive price

 

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  Pretreatment for Lamination

 

 

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