Fan-Out Panel Level Package Multilayer RDL Defect
Model: Fan-Out Panel Level Package Multilayer RDL Defect
Category: AOI
Exhibitor: Favite Inc.
Booth No: TBA
Characteristic
Eliminate non-current layer line pattern interference; effective detection of current layer line defects Compatible with 4 Layer RDL fine line L/S=2μm line products Die to Die & Die to CAD
Other Products
-
Vertical type panel clean machine
-
High-resolution Image detection camera
-
Auto-Alignment Collimated Exposure Units (for Outer/Inner layer)
-
Automatic plating solution control system
-
STANDARD VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
-
Soldering Robot
-
Automatic Optical Inspection
-
LASER THICKNESS TEST MACHINE
-
Pretreatment fo Low Profile DFR
-
日本 SANSO PUMP PMD-331B6K 耐酸鹼泵浦
Products you may be interested in
-
Hole & Routing 2D Analyzer
-
AOI
-
Automated Optical Inspection System
-
3D Flatness Checker
-
Circuit AOI
-
KURABO All SERIES Manual/Automatic Type
-
PCB WARPAGE CHECKER
-
Roll to roll inspection system
-
Metal mask inspection system
-
Instantaneous inspection measuring machine
-
Fusion 22
-
Online Chip on Tray Placing Error Checking Machine
-
Automated Optical Shaping
-
Automatic Optical Inspection System(AOI) for LVH
-
Defect Inspection Machine for Electroplated Copper Lines (Before Flash Etch) (for HDI/SLP/IC substrate/ETS)
-
Scanning instant inspection measuring machine
-
Final visual Inspection (driver IC 6s)
-
Final visual Inspection
