Multilayer Bonding System
Model: CEDAL EQUIPMENT Bonding 130
Category: Eyelets
Exhibitor: PAN-TEC CORP. LTD.
Booth No: TBA
Characteristic
Multilayer Bonding System
Other Products
-
Foam Type Buff
-
Out-layer ES Line
-
In-Line Plasma Cleaning System
-
YC-PAD HOLDER
-
TCO cleaner
-
Auto-Alignment UV-LED Exposure Units(for inner layer / outer layer)
-
PCB AVI
-
EMMA Moving Probe Tester
-
Multi Layer Hot Plate Hot Air Oven
-
Fully-Automatic Collimated Exposure Units (For Outer Layer)
