U-TURN VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
Model: UVCP
Category: Electrolytic Plating Equipment
Exhibitor: APPLIED EQUIPMENT LIMITED
Booth No: TBA
Characteristic
-Specially for SAP and MSAP process of IC substrate i.e. Flip Chip BGA, CSP, FC CSP, it can be collocated with resister plating process. -One fixed size of frame to assist production and transportation without touching panels to get better plating quality of pattern. -Use 6 axis robot with CCD to detect edges of panels accurately. -Unloading M/C to unload panel automatically to save manpower. -For extra fine pattern: LW/LS :12/ 9 μm -Uniform distribution of plating quality. -Remarkable throwing power for extra fine pattern on thin board, blind via filling and through hole filling. -Modular design fulfill different requirement of production. -Auto. online chemical stripping. -Easy operation and maintenance.
Other Products
-
Hole Inspection System
-
PCB automatic inspection production line with Online PCB warping and straightening machine / warpage inspection machine / hole inspection machine
-
X-ray Drilling machine (Standard type)
-
Entek Line
-
DPS
-
Lamination of DFR
-
Filtering, thickening, and dehydration equipment
-
REINFORCED PLATE BOARD LAMINATING MACHINE
-
The Pre & Post Treatment Line
-
Epoxy Molding Compound Trimming
Products you may be interested in
-
STANDARD VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
-
U-TURN VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT(DOUBLE TYPE)
-
VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT (DOUBLE TYPE)
-
DOUBLE TRACK VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
-
Vertical Continuous Copper Plating Equipment
-
VCP on-line rack monitoring system
-
Anode basket
-
Immerison Bus Bar
-
pe- DC power supply
-
PVC/PP TRUE UNION BALL VALVE
-
pe- pulse reverse rectifier
