- For Visitors
- Forums
- Opening Ceremony & Keynote Speech
- TPCA Show CEO Summit
- AI Key Trends Forum
- Tech × Total Solution
- IMPACT-IAAC
- IMPACT Open seminar - IEEE Distinguished Lecture
- Analysis of the glass materials application in advanced packaging
- PCB Net-Zero & Sustainability Forum: From Net Zero to AI-Driven Smart Manufacturing
- Decoding TGV Technology Seminar: Seizing the Future
- From Quality & Reliability to Advanced Packaging:Driving Innovation through Global Standards
- Events
- Opening Ceremony & Keynote Speech
- TPCA Show Golf Tournament
- MOU Signing Ceremony for the Advanced IC Substrate Cluster in Taoyuan Aerotropolis Industrial Zone III
- Taiwan PCB Institute - The New Power of AI PCB Talent
- IMPACT-IAAC Excursion Tour
- Master Frank Bai's New Book Launch & Signing Event:Advanced Packaging and Carrier/Main PCB
- For Exhibitors
- Show Report