IMPACT Open Seminar
Brief Description：
Focusing on SiPh, CPO, and heterogeneous integration in the AI era, this session brings together experts from SEMCO, Yole, MPI, and others to share the latest developments in CoPoS, TGV, advanced packaging, and photonic integration.
Date：10/20（Tue）
Time：14:00-16:00
Brief Description：
Focusing on large-form-factor advanced packaging and system assembly, this session brings together experts from AT&S, Marvell, ASE, and Intel to share the latest technologies and industry perspectives on substrates, packaging, system integration, and high-performance computing applications.
Date：10/21（Wed）
Time：15:00-17:00
Speaker
Dr, John Lau, Unimicron Technology Corp.
Event Details
Brief Description：
This lecture will introduce the fundamentals and key advantages of Cu-Cu hybrid bonding, including higher density, finer pitch, lower profile, and improved performance. It will also highlight 21 HVM or upcoming HVM products and 12 emerging applications, along with future development opportunities in performance, power, form factor, and cost optimization.
Date：10/22（Thu）
Time：13:00-14:00