Decoding TGV Technology Seminar: Seizing the Future｜402a
Speaker
Ting Hao Lin, Kinsus Interconnect Technology RD Fellow
Event Details
Brief Description：
With the increasing size of advanced packaging, there is an urgent need to improve the dimensional stability, coplanarity, and low expansion/contraction characteristics required for packaging. Traditional ABF substrate core boards have historically focused on reinforce-fiber and filler. Furthermore, to reduce warping resistance under high stress and high temperature changes, system manufacturers have proposed changing the core board structure in recent years, particularly with the still-discussed glass substrate technology.
Date：10/22（Thu）
Time：10:30-11:30