From Quality & Reliability to Advanced Packaging:Driving Innovation through Global Standards｜402a
Event Details
Brief Description：
As AI, high-performance computing (HPC), and advanced packaging continue to accelerate, the electronics industry is facing new challenges in density, reliability, and manufacturing precision.
Hosted by the Global Electronics Association, this seminar brings together industry and technical experts to explore the latest developments in PCB quality, advanced packaging, microelectronics assembly, engineering data, and global standards. Key topics include IPC-A-600M and IPC-6012/6013 requirements, AI-driven FC-BGA substrate innovation, IPC-7077/9541 standards for wire bonding and SiP, international standards and electronic component databases, Flux-Free formic acid soldering, HBM, 3D stacking, Micro Bump technologies, and the global strategy of the ADEPT Advanced Electronic Packaging Technology Committee. The event connects global standards with emerging technologies to help the electronics industry prepare for next-generation manufacturing.
Date：10/22（Thu）
Time：13:30-14:00