Tech × Total Solution
10/20（Tue）
| Time | Booth | Speaker | Topic |
|---|---|---|---|
| 15:00-15:40 | J-1433 | OKUNO TAIWAN CO., LTD. | High-Adhesion Electroless Copper Seed Layer Formation Process for Glass Substrates |
| 14:00-14:40 | K-1431 | Rogers Taiwan Inc. | Rogers Solutions for High Frequency Applications |
| 15:00-15:40 | K-1431 | JMP Statistical Discovery | Data-Driven Quality Improvement for PCB and ABF Substrates: From Anomaly Analysis to Yield Enhancement |
| 16:00-16:40 | K-1431 | Shenzhen Jinzhou Precision Technology Co., Ltd. | Solutions for Mechanical Drilling of AI Computing PCBs |
| 14:00-14:40 | N-1431 | TEMG TAI PCB MACHINERY CO., LTD. | Zero-Liquid-Discharge Systems for PCB Fabs and IC Substrates with High ROI – A Breakthrough in Sustainability |
| 15:00-15:40 | N-1431 | SUZHOU VEGA TECHNOLOGY CO.,LTD. | AI PCB Machining and Inspection Solutions |
| 16:00-16:40 | N-1431 | NICHIAS Corporation | Driving AI Performance with Advanced PTFE Film“FCLEX™” for High-Speed and High-Frequency PCBs |
10/21（Wed）
| Time | Booth | Speaker | Topic |
|---|---|---|---|
| 11:00-11:40 | J-1433 | TPK Holding Co., Ltd. | Process Innovations Driving TGV Toward Commercialization |
| 14:00-14:40 | J-1433 | SCHMID Group | Void Free Through Glass Via Manufacturing Solutions |
| 15:00-15:40 | J-1433 | SCHMID Group | PLP Requirements for wet processing tools |
| 11:00-11:40 | K-1431 | Taiwan Union Technology Corporation | M10/M11 class CCL materials Technology |
| 14:00-14:40 | K-1431 | BOSSMEN INC. | Comprehensively Enhancing PCB Manufacturing Yield through Smart IoT Storage and Advanced Environmental Monitoring Technologies |
| 15:00-15:40 | K-1431 | Rogers Taiwan Inc. | Rogers High-Speed PCB Solutions for 224/448Gbps |
| 11:00-11:40 | N-1431 | MacDermid Alpha Electronics Solutions | The Affinity Advantage: ENIG & ENEPIG Solutions |
| 14:00-14:40 | N-1431 | PILLAR Corporation | State-of-the-art PTFE High-layer count PCB solution and Ultra low Dk and Df PTFE CCL |
| 15:00-15:40 | N-1431 | AGC Inc. | AGC solutions for next generation CCL |
| 16:00-16:40 | N-1431 | Wah Lee Industrial Corp. |
Current Status and Prospects of < 5μm L/S Exposure and Excimer Processing Technologies in Advanced Packaging |
10/22（Thu）
| Time | Booth | Speaker | Topic |
|---|---|---|---|
| 11:00-11:40 | J-1433 | MacDermid Alpha Electronics Solutions | Enabling Scalable Glass Substrate Manufacturing Through Bottom-Up Fill. |
| 13:00-13:40 | J-1433 | President Capital Management Corp. | Investment Outlook on PCB Industry Development Trends |
| 11:00-11:40 | N-1431 | ITRI | Low-Carbon and Low-Loss Electronic Packaging Materials: From Materials Innovation to Validation Platforms |