Topnano will participate in the TPCA SHOW Taiwan Circuit Board Industry International Exhibition at Taipei Nangang Exhibition Hall 1F from October 23 to 25, 2024, with booth number K230. This exhibition is an important event in the electronics manufacturing industry, attracting the participation of many industry experts and companies. Topnano will showcase its latest PCB-related application products here, emphasizing its leadership in the field of high-performance circuit board technology. The key products on display include the glue-free ultra-thin flexible copper foil substrate 2L-FCCL, which is specially designed for thin line applications and has excellent flexibility and stability; and the 3um peelable ultra-thin copper foil with carrier , especially suitable for advanced applications such as IC carrier boards and BT carrier boards. These innovative technologies not only improve product performance, but also meet the needs of modern electronic equipment for lightweight and high efficiency. Topnano sincerely invites people from all walks of life to visit booth K230 and exchange opinions. We look forward to deepening our interactions with customers and partners through this exhibition, and jointly exploring new trends in future circuit board technology.