INSIDIX Thermal Warpage System / CTE Measurement Equipment
Model: TDM (Topography Deformation Measurement)
Exhibitor: Kingyoup Enterprises Co., Ltd.
Booth No: TBA
Characteristic
[System Overview] The Insidix TDM Thermal Deformation Measurement System is engineered for a wide range of electronic applications, including components, substrates, and PCB/PCBA assemblies. The system measures Thermal Warpage and the Coefficient of Thermal Expansion (CTE) across broad temperature ranges, providing critical data for material selection, process optimization, and reliability evaluation.
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