TECHNO HORIZON TI-X Series｜High-Precision 3D CT Automated X-ray Inspection Systems

Model: TI-X500i／TI-X700i／TI-X900i

Booth No: TBA

Characteristic

TECHNO HORIZON TI-X Series High-Precision 3D CT Automated X-ray Inspection Systems The TECHNO HORIZON TI-X Series provides high-precision automated X-ray inspection solutions for PCB, SMT, semiconductor and advanced packaging processes. Combining high-resolution X-ray imaging, 2D/3D CT, precision motion control, image processing and automated defect inspection technologies, the series enables non-destructive inspection of internal structures that are difficult or impossible to observe using conventional optical inspection methods. The TI-X Series, including the TI-X500i, TI-X700i and TI-X900i, addresses a wide range of inspection requirements for PCB/PCBA, Flip-Chip, BGA, C4 bumps, IC substrates and advanced semiconductor packaging. High-Resolution 2D / 3D CT Non-Destructive Inspection X-ray transmission imaging and 3D CT technology enable internal structures to be inspected without damaging the product. Applications include BGA and C4 bumps, solder joints, voids, through holes, internal filling conditions and semiconductor packages. High-Precision, High-Definition X-ray Imaging Micro-focus X-ray technology, high-sensitivity detectors, precision motion control and advanced image processing provide high-resolution images for detecting minute structures and internal defects in PCBs, high-density electronic assemblies and advanced semiconductor packages. Vertical, Oblique and 3D CT Inspection Multiple imaging modes, including vertical transmission, oblique imaging and 3D CT, enable internal structures to be inspected from different angles for improved visualization of overlapping structures, solder joints, bumps and package defects. Automated In-Line Inspection In-line models such as the TI-X500i and TI-X700i can be integrated into automated production environments for board transport and inspection, reducing manual handling and supporting high-volume quality inspection. AI-Assisted Defect Detection Advanced image processing and AI technologies assist with defect detection, positioning, dimensional and area analysis, and inspection result management, improving repeatability and reproducibility. Designed for Advanced Semiconductor Packaging The TI-X Series covers applications ranging from SMT and PCB/PCBA inspection to Flip-Chip, BGA, C4 bumps, IC substrates and advanced semiconductor packaging.