Precision laser micromachining systems

 

Model: PSG DR20x0/30x0 series

Category: Laser Driller

Exhibitor: Microsys Engineering Co., Ltd.

Booth No: TBA

 

Characteristic

 

Laser drilling for advanced PCBs and IC packages  High-speed through-hole drilling  Optimized for advanced materials (ABF, PI, etc.)  Ultrashort pulse laser technology  Minimized heat-affected zone (HAZ)  No delamination  Customizable drill taper  Hole diameters up to 10μm

 

Other Products

 

• 

  Magnetic drive seal-less chemical pump

• 

  Clean machine series for CCL Caul Plate

• 

  UV CURING MACHINE

• 

  Rubber Roller

• 

  GLASS CUTTING

• 

  Neutralizer PFH

• 

  EMMA Moving Probe Tester

• 

  Roll to Roll CCD Printing Drying Line

• 

  Various processing examples

• 

  CO2/UV Laser Job Shop Service

 

 

 

Back