Precision laser micromachining systems

 

Model: PSG DR20x0/30x0 series

Category: Laser Driller

Exhibitor: Microsys Engineering Co., Ltd.

Booth No: TBA

 

Characteristic

 

Laser drilling for advanced PCBs and IC packages  High-speed through-hole drilling  Optimized for advanced materials (ABF, PI, etc.)  Ultrashort pulse laser technology  Minimized heat-affected zone (HAZ)  No delamination  Customizable drill taper  Hole diameters up to 10μm

 

Other Products

 

• 

  Melt-Blown Filter Cartridge

• 

  Auto Brushing Machine

• 

  Dehumidification Sludge Dryer (DHD Dryer)

• 

  Copper Foil sputtered Graphite Thermal Film

• 

  Oil-less Rotary Vane Type Vacuum Pumps

• 

  Pulse-Reverse Rectifier

• 

  Contactless Endeffector for wafer/Solar Cell

• 

  Stencil Laser Equipment

• 

  Horizontal Desmear PTH Equipment

• 

  Intelligent pressure plugging via machine

 

 

 

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