Precision laser micromachining systems

 

Model: PSG DR20x0/30x0 series

Category: Laser Driller

Exhibitor: Microsys Engineering Co., Ltd.

Booth No: TBA

 

Characteristic

 

Laser drilling for advanced PCBs and IC packages  High-speed through-hole drilling  Optimized for advanced materials (ABF, PI, etc.)  Ultrashort pulse laser technology  Minimized heat-affected zone (HAZ)  No delamination  Customizable drill taper  Hole diameters up to 10μm

 

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