The impact of Q glass clade material on circuit board manufacturing technology

 

In recent years, driven by the need for high-frequency, high-speed signals and the trend toward larger electronic component packaging, PCB base materials have undergone noticeable changes.

 

Glass fiber fabrics of various types are not a new topic for printed circuit boards. Many years ago, to meet specialized requirements in military and aerospace applications, multiple grades of glass fiber were introduced under different designations. In traditional PCBs, the most common grade is E-glass; subsequently, specialty glass fibers for specific applications—such as NE, S, T, and Q—have appeared.

 

These materials are primarily composed of various mineral sands combined with silicon dioxide (SiO₂), also known as quartz. The simplest way to explain this is: the higher the quartz content, the stronger the physical properties (e.g., mechanical strength and stability) of the glass fiber, and the coefficient of thermal expansion (CTE) correspondingly decreases.

 

If you would like a deeper understanding of Q-Glass materials, you are welcome to join Q-Glass Exploration.

 

 

【Speaker】Ting Hao Lin / Kinsus Interconnect Technology RD Senior Leader

【Date】 October 24, 2025 (Friday)

【Venue】4F, L-1308