AI as a New Engine for Industry: Connectivity × Application × Talent Cultivation to Co-Create Competitiveness
AI產業新引擎:鏈結× 應用× 培才共創競爭力
PCB GPT Launches for the First Time!!
Experts Discuss Innovative Application Trends in AI for Manufacturing.
【Time】2025/10/22 13:00-17:00
【Location】TaiNEX1 Room 402abc
PCB GPT首登場!!
專家暢談製造業導入AI 創新應用趨勢
PCB Net-Zero Forum-Emerging Applications Shaping PCB Industry Trends and Strategies
PCB 淨零前瞻論壇-新興應用驅動下的PCB產業趨勢與策略佈局
Amid the global push for net-zero, the PCB industry faces both challenges and opportunities. Emerging applications such as AI, low-orbit satellites, and drones are driving demand and spurring advances in materials, processes, and equipment. Supported by government resources, the “PCB Net-Zero Forum” will spotlight low-carbon technologies, smart manufacturing, and new market opportunities. Experts from industry, government, and academia will share insights on how the sector can meet global supply chain requirements through decarbonization, smarter processes, and diversification—building consensus toward a sustainable, high-value future.
【Guidance Unit】Industrial Development Administration, Ministry of Economic Affairs
【Organizers】III, TPCA
【Event Time】October 23, 2025 (Thursday) 10: 00-12:05 (09:40 starts registration)
【Event Venue】402ab 4F, Hall 1, Taipei Nangang Exhibition Center
【Language】Mandarin
【Registration】link
Program Agenda:
Time |
Topic |
Speaker |
09:40 |
Registration |
|
10:00-10:05 |
Opening Remarks |
|
10:05-10:25 |
From Low-Carbon to High-Value: AI, Satellites, and Drones Driving New PCB Momentum |
Dr. Yuan-sung Chang, Analyst, ITRI |
10:25-10:50 |
Strategic Pathways for Materials: Decarbonization Actions and Upgrades |
Materials Supplier (Inviting) |
10:50-11:00 |
Coffee Break |
|
11:00-11:25 |
Low-Carbon Flexible Board Technologies and Market Opportunities in Robotics |
PCB Manufacturer (Inviting) |
11:25-11:50 |
Plasma Technology Driving PCB Process Upgrades: Addressing High-Frequency, High-Speed and Emerging Markets |
Dr. Cheng-Che(Jerry) Hsu Professor, National Taiwan University |
11:50-12:05 |
PCB Industry Transformation Achievements and Launch of Carbon Footprint Mechanism |
III |
* The organizers reserve the right to adjust the program agenda.