Semiconductor and PCB Heterogeneous Integration Summit
半導體與PCB異質整合高峰論壇
PCBs, often called the “Mother of the Electronics Industry,” form the essential backbone that interconnects electronic components and have grown into one of Taiwan’s trillion-dollar industries. As demand rises for higher density, precision, and speed, PCBs continue to advance, enabling AI, EVs, robotics, and smart healthcare while becoming increasingly integrated with the semiconductor value chain.
The TPCA 2025 Summit Forum will spotlight semiconductor–PCB heterogeneous integration. It will trace Taiwan’s rise from the periphery to the core of the global semiconductor industry, highlight trends in heterogeneous integration and advanced packaging, and explore growth opportunities and collaborative innovation in the PCB sector. The forum aims to equip participants with insights into the future trajectory of semiconductor–PCB integration and foster the co-development of a resilient industry ecosystem.
【Organizers】TPCA, Zhen Ding Tech. Group
【Event Date】October 23, 2025 (Thursday)
【Event Time】10:10–11:40 (Admission opens at 09:40)
【Event Venue】Main Stage, 4F, Hall 1, Taipei Nangang Exhibition Center (L-1308)
【Language】Mandarin
【Event Fee】Free of charge. Seating is limited, so we encourage early online registration to ensure participation and receive related information.
【Registration】When applying for the TPCA Show visitor badge, you may simultaneously select the forum activity.
Program Agenda:
|
Time |
Topic |
Speaker |
|
09:40-10:10 |
Registration |
|
|
10:10-10:15 |
Opening Remarks |
Lawrence Chang, Chairman TPCA |
|
10:15-10:20 |
Moderator’s Opening |
Chen-Fu Chien, President |
|
10:20-10:35 |
From the Edge to the Core: Foundations and Prospects of Taiwan’s Semiconductor Industry |
Ching-Tay Shih, Chair Professor National Tsing Hua University |
|
10:35-10:50 |
Trends in Heterogeneous Integration and Advanced Packaging in the Semiconductor Industry |
Tien Wu, International Board Chair |
|
10:50-11:05 |
Opportunities and Co-Creation in the PCB Industry |
Charles Shen, Chairman Zhen Ding Tech. Group |
|
11:05-11:35 |
Semiconductor and PCB Heterogeneous Integration Summit |
Moderator: Chen-Fu Chien, President of Zhen Ding Tech. Group --------------------------------------------------------------- Panelists： Ching-Tay Shih, Chair Professor of National Tsing Hua University Tien Wu, International Board Chair of SEMI Charles Shen, Chairman of Zhen Ding Tech. Group |
|
11:35-11:40 |
Closing Remarks |
Charles Shen, Chairman Zhen Ding Tech. Group |
* The organizers reserve the right to adjust the program agenda.