Semiconductor and PCB Heterogeneous Integration Summit  

半導體與PCB異質整合高峰論壇   

 

 

PCBs, often called the “Mother of the Electronics Industry,” form the essential backbone that interconnects electronic components and have grown into one of Taiwan’s trillion-dollar industries. As demand rises for higher density, precision, and speed, PCBs continue to advance, enabling AI, EVs, robotics, and smart healthcare while becoming increasingly integrated with the semiconductor value chain.

 

The TPCA 2025 Summit Forum will spotlight semiconductor–PCB heterogeneous integration. It will trace Taiwan’s rise from the periphery to the core of the global semiconductor industry, highlight trends in heterogeneous integration and advanced packaging, and explore growth opportunities and collaborative innovation in the PCB sector. The forum aims to equip participants with insights into the future trajectory of semiconductor–PCB integration and foster the co-development of a resilient industry ecosystem.

Moderator:

Chen-Fu Chien, President of Zhen Ding Tech. Group

Panelists：

Ching-Tay Shih, Chair Professor of National Tsing Hua University

C.P. Hung,ASE Vice President

Charles Shen, Chairman of Zhen Ding Tech. Group