Laser Machining Equipment

 

Model: CombiDrill,PicoμDrill,LaserμFlex,PicoFlex

Category: Laser Driller

Exhibitor: SCHMOLL ASIA PACIFIC LTD.TAIWAN BRANCH (HK)

Booth No: TBA

 

Characteristic

 

A variety of laser processing equipment, with different laser sources to meet different processing needs. LaserμFlex, au ultraviolet laser cutting equipment, suitable for flex cutting. CombiDrill, a CO2 + UV dual Lasers machine, suitable for the blind-via drilling of HDI panel with thick surface copper more than 10 microns. PicoFlex, a green light picosecond laser cutting equipment, suitable for most cutting applications, picosecond repetition provides low carbonaztion capability. PicoμDrill, a picosecond laser drilling equipment is used for microvia pulsing, diameter range 25-75 microns (diameter range depending on the laser wavelength and processing material). LaserMaster Platform provides an automation platform with robotic arms. The dual workstation design can be matched with different Lasers to meet various automated production requirements.

 

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  Diamond Coating Router-2f end mill

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  side hug tunnel conveyor oven

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  Wafer Mounter, UV Curing System, and Expansion Tool

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  Oxide Part B

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  Diamond Direct Imaging

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  Polyimide Film Sputter Copper

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  Double Sided Simultaneous Automatic Exposure Systems for Inner Layers

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  Horizontal PTH Equipment

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  Anaerobic N2 flatting machine

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  日本 SANSO PD-E51W1A DC直流 耐酸鹼泵浦

 

 

 

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