Automated Laser Depaneling of Rigid and Flexible PCBs

Model: LPKF PicoLine 3000

Exhibitor: Microsys Engineering Co., Ltd.

Booth No: TBA

Characteristic

LPKF PicroLine 3000 Ci Specification Laser Class, Power Class 1, Power up to 48W Working area(X x Y x Z) 300 mm x 250 mm x 11 mm Height of assembly(top/bottom) 27 mm/7 mm (1.1”/0.3”) Positioning accuracy ± 25 μm (1 Mil) @ 22 °C ± 2 °C Diameter of focused laser beam 25 μm (1 Mil) Wavelength 532nm System Dimensions (W x H x D) 875 mm x 1530 mm x 2000 mm Weight(kg) ~1000 kgs Facility requirements 400 VAC, 50-60 Hz, 16 A, 6.5 kVA, 0.6MPa(87 PSI), 130 l/min Required accessories Exhaust unit, external conveyor, production fixture, SMEMA interface