Laser Microjet System
Model: SYNOVA LDS 300M
Category: Laser Driller
Exhibitor: Microsys Engineering Co., Ltd.
Booth No: TBA
Characteristic
◆Solutions for compound semiconductors, power devices, and wafer dicing ◆Utilizes water-conducting lasers to achieve smooth cutting edges ◆Water jets simultaneously dissipate heat without creating a heat-affected zone (HAZ) ◆Processes any shape without the limitations of traditional tooling for right-angle machining ◆Capable of machining challenging materials such as SiC, ceramics, and diamond
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