Laser Microjet System

 

Model: SYNOVA LDS 300M

Category: Laser Driller

Exhibitor: Microsys Engineering Co., Ltd.

Booth No: TBA

 

Characteristic

 

◆Solutions for compound semiconductors, power devices, and wafer dicing ◆Utilizes water-conducting lasers to achieve smooth cutting edges ◆Water jets simultaneously dissipate heat without creating a heat-affected zone (HAZ) ◆Processes any shape without the limitations of traditional tooling for right-angle machining ◆Capable of machining challenging materials such as SiC, ceramics, and diamond

 

Other Products

 

• 

  Back-Up Board

• 

  Hole Doctor

• 

  Neutralizer Conditioner PFH

• 

  Panel clean machine

• 

  Embossed Mylar

• 

  Jet scrubber line (Pumice)

• 

  RACK TYPE AUTO CONVEYOR OVEN FOR CLEAN ROOM

• 

  On-line PCB thickness Inspector

• 

  Edge Computer

• 

  DRY FILM STRIPPER

 

 

 

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