Laser Microjet System

 

Model: SYNOVA LDS 300M

Category: Laser Driller

Exhibitor: Microsys Engineering Co., Ltd.

Booth No: TBA

 

Characteristic

 

◆Solutions for compound semiconductors, power devices, and wafer dicing ◆Utilizes water-conducting lasers to achieve smooth cutting edges ◆Water jets simultaneously dissipate heat without creating a heat-affected zone (HAZ) ◆Processes any shape without the limitations of traditional tooling for right-angle machining ◆Capable of machining challenging materials such as SiC, ceramics, and diamond

 

Other Products

 

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  Roll to Roll Dry Film Laminator

• 

  Probe card Punching machine

• 

  Thermogravimetric Analysis

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  X-Ray Inspector

• 

  Ceramic Brush &Hi-Cut Buff for HDI/BGA Process

• 

  3D Laser Blind Via Inspection Machine

• 

  Small Automatic Polishing Machine

• 

  Reduction Solution Cu

• 

  Oxide Part A

• 

  SEM & EDAX

 

 

 

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