Laser Microjet System

 

Model: SYNOVA LDS 300M

Category: Laser Driller

Exhibitor: Microsys Engineering Co., Ltd.

Booth No: TBA

 

Characteristic

 

◆Solutions for compound semiconductors, power devices, and wafer dicing ◆Utilizes water-conducting lasers to achieve smooth cutting edges ◆Water jets simultaneously dissipate heat without creating a heat-affected zone (HAZ) ◆Processes any shape without the limitations of traditional tooling for right-angle machining ◆Capable of machining challenging materials such as SiC, ceramics, and diamond

 

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  S.E.S Line

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  Chem. 168A Solution

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  Jetcleaner HL

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  Drive E1

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  Sputtering Nano Copper(Cu) Conductive materials

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  Copper Briightener

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  AGV & auto-packing planning/implementing

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  Diamond Coating Router-2f end mill

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  PCB Dimension Distributed Measurement Machine

 

 

 

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