Laser Microjet System

 

Model: SYNOVA LDS 300M

Category: Laser Driller

Exhibitor: Microsys Engineering Co., Ltd.

Booth No: TBA

 

Characteristic

 

◆Solutions for compound semiconductors, power devices, and wafer dicing ◆Utilizes water-conducting lasers to achieve smooth cutting edges ◆Water jets simultaneously dissipate heat without creating a heat-affected zone (HAZ) ◆Processes any shape without the limitations of traditional tooling for right-angle machining ◆Capable of machining challenging materials such as SiC, ceramics, and diamond

 

Other Products

 

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  Precision Coated Router HCN Series

• 

  Compressed Activated Carbon Filter Cartridge

• 

  DC Power Supply

• 

  Back-drill plate thickness measurement machine

• 

  COLD PRESS OF ELECTRIC HEATING PRESS

• 

  PVC/CPVC FLANGE

• 

  Automatic PC Board Ringloading Machine

• 

  Micromaterial processing with Laser Technology

• 

  Automated Laser Depaneling of Rigid and Flexible PCBs

• 

  WOL Dust-Free Oven

 

 

 

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