Microsys Engineering Co., Ltd.

 

Area: 干、湿制程设备区

Booth No: N-602

Website: http://www.microsys-e.com.tw

 

Exhibitor Profile

 

Microsys Engineering Co., Ltd., established in 1991, has consistently upheld the principles of "Professionalism, Responsibility, and Innovation." We have an experienced team of sales elites and professionally trained after-sales service staff. With a focus on emerging technologies, we help clients stay at the forefront of innovation by connecting them with global advancements.

 

Exhibit Products

 

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  Microqubic 2D/3D Microscopes and Modular Imaging Systems

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  SW for Laser Machines

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  Precision laser micromachining systems

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  Contactless Endeffector for wafer/Solar Cell

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  Wafer Mounter, UV Curing System, and Expansion Tool

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  SSAIL (Selective Surface Activation Induced by Laser)

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  Maskless lithography systems

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  8 inch Maskless Lithography System

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  Ultra-compact CtS System with UV laser diodes

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  Femtosecond Laser Hybrid Micro-fabrication System

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  multi-functional printing and coating system

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  Laser Microjet System

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  Stencil Laser Equipment

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  Automated Laser Depaneling of Rigid and Flexible PCBs

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  LPKF 3D-MID LDS

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  LPKF 3D-MID LDS

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  SinglePico Technology in Laser Processing

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  Micromaterial processing with Laser Technology

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  Micromaterial processing with Laser Technology

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  Stencil Laser Equipment

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  Stencil Laser Equipment

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  Micromaterial processing with Laser Technology

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  UV Laser system for Flex Drilling and Cutting

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  LPKF 3D-MID LDS

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  LPKF Through-Glass Vias with Laser Precisions

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  LPKF StencilLaser

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  LPKF ML UV Laser Cutting

 

 

 

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