Micromaterial processing with Laser Technology
Model: LPKF ProtoLaser U4
Category: Circuit Board Processing
Exhibitor: Microsys Engineering Co., Ltd.
Booth No: TBA
Characteristic
The LPKF ProtoLaser U4 uses a UV laser source. Many material groups are easy to process at these wavelengths – without additional tools, masks, or films. The LPKF ProtoLaser U4 builds on the success of its predecessor and expands its range of applications with targeted innovations.
Other Products
-
Back-drill plate thickness measurement machine
-
Digital Microscope with Laser-based Elemental Analyzer
-
PP dust-free Automatic Prepreg Cutting Machine
-
Kurabo BBMaster-8800
-
Vertical Electroless Copper
-
Fully-Automatic UV-LED Exposure Units (for outer layer)
-
Pretreatment fo Low Profile DFR
-
Anode
-
Wafer Mounter, UV Curing System, and Expansion Tool
-
Hitachi X-ray thickness gauge
Products you may be interested in