Micromaterial processing with Laser Technology
Model: LPKF ProtoLaser U4
Category: Circuit Board Processing
Exhibitor: Microsys Engineering Co., Ltd.
Booth No: TBA
Characteristic
The LPKF ProtoLaser U4 uses a UV laser source. Many material groups are easy to process at these wavelengths – without additional tools, masks, or films. The LPKF ProtoLaser U4 builds on the success of its predecessor and expands its range of applications with targeted innovations.
Other Products
-
Reel-to-Reel Plasma Desmear Machine
-
Silicon Control Rectifier－Air Water-Cooling
-
High Pressure Rinsing Line
-
Auto Loading Alignment System with X-Ray Target Drilling Machine
-
Oxide Part B
-
Drill bit
-
Acid Cleaning
-
Auto Cutting Laminator Machine
-
IC Substrate(PBGA/CSP/FCCSP)-Sputer coating
-
Final Clean Line
Products you may be interested in
