Micromaterial processing with Laser Technology

 

Model: LPKF ProtoLaser S4

Category: Circuit Board Processing

Exhibitor: Microsys Engineering Co., Ltd.

Booth No: TBA

 

Characteristic

 

The LPKF ProtoLaser S4 features the new LPKF design, combining a classy look with clever solutions for operation and maintenance. Integration of the control PC is optional. Cost-Effectiveness Built In The ProtoLaser S4 is a valuable tool in the electronics lab. It can quickly and accurately generate fine structures and uses a special procedure for ablating large areas. The laser process requires no masks or tools to produce one-offs or individual marks. Expanded Process Window Switching to a green laser wavelength increases the range of applications. A green laser is much less likely to burn the substrate. It can also reliably machine inhomogeneous metal layers up to 6 μm in thickness – e. g., boards with fully metallized surfaces following galvanic via plating. The ProtoLaser S4 can cut rigid or flexible substrates efficiently with thicknesses of up to 0.8 mm.

 

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