Sputtering Nano Copper(Cu) Conductive materials
Model: Sputtering Nano Copper(Cu) Conductive materials
Category: Concductor Thickness
Exhibitor: TOP Nanometal Corporation
Booth No: TBA
Characteristic
1.Using Roll to Roll(R2R) vacuum sputtering process, we can manufacture nano-grade copper layer materials. 2.Copper thickness ranges from 2um to 6um, suitable for fine pitch (Pitch<30um) layout design. 3.Our sputtering 2L-FCCL can be used for Touch Panel module of wearable device. 4.Product features include: high heat resistance, fine flexural/bending endurance, good peel strength, copper layer uniformity, and dimensional stability.
Other Products
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REEL TO REEL VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
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Automatic Drill Bit Inspection Machine Desktop Model
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Vertical Panel / Pattern Plating
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Nuvogo DI Series
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In-Line Sputtering System
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PVC FOOT VAVLE
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UV Laser Drilling Machine ASIDA-JG22,JG23
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Final Finishing
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Fully-Automatic Collimated Exposure Units (For Inner Layer)
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High Efficiency Rectifier
