Sputtering Nano Copper(Cu) Conductive materials

Model: Sputtering Nano Copper(Cu) Conductive materials

Booth No: TBA

Characteristic

1.Using Roll to Roll(R2R) vacuum sputtering process, we can manufacture nano-grade copper layer materials. 2.Copper thickness ranges from 2um to 6um, suitable for fine pitch (Pitch<30um) layout design. 3.Our sputtering 2L-FCCL can be used for Touch Panel module of wearable device. 4.Product features include: high heat resistance, fine flexural/bending endurance, good peel strength, copper layer uniformity, and dimensional stability.