LPKF 3D-MID LDS

Model: LPKF Fusion 3D 1200

Exhibitor: Microsys Engineering Co., Ltd.

Booth No: TBA

Characteristic

The MicroLine 3D is a laaser system specially developed for the volume production of molded interconnect devices (MIDs). The system writes the interconnect pattern onto an injection molded component from the CAD data. MicroLine 3D users benefit from a system designed for cost-effective production of 3D-MIDs with the LPKF-LDS process. The 3D structuring of metal layers, cutting small flexible and rigid PCBs, structuring ultra-fine circuits in copper clad or resists. It can also create abrasion resistant laser markings and engravings.