Wafer Mounter, UV Curing System, and Expansion Tool
Model: POWATEC Manual WM P-200NC/P-300NC
Category: Lamination
Exhibitor: Microsys Engineering Co., Ltd.
Booth No: TBA
Characteristic
Main features: Limit the contact between the chuck and wafer surface to only a 6mm border Design ensures limited force is applied onto the wafer while mounting Able to process very sensitive wafers or wafers with structures
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4.0mm Finished Thickness
