UV Laser system for Flex Drilling and Cutting

Model: LPKF ML 5000

Category: Others

Exhibitor: Microsys Engineering Co., Ltd.

Booth No: TBA

Characteristic

The MicroLine 5000 is a laser drilling and cutting system specifically tailored to the needs of the flexible circuit industry. With the ability to drill holes down to 20 μm, a variety of both organic and inorganic substrates can be processed such as: Flexible PCBs IC substrates High Density Interconnect PCBs