UV Laser system for Flex Drilling and Cutting
Model: LPKF ML 5000
Category: Others
Exhibitor: Microsys Engineering Co., Ltd.
Booth No: TBA
Characteristic
The MicroLine 5000 is a laser drilling and cutting system specifically tailored to the needs of the flexible circuit industry. With the ability to drill holes down to 20 μm, a variety of both organic and inorganic substrates can be processed such as: Flexible PCBs IC substrates High Density Interconnect PCBs
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