Ultrasonic Cutting System for Cross-Section Observation
Model: Polish Cut System CSX-100 lab
Category: Others
Exhibitor: TechTrend Science Co., Ltd.
Booth No: TBA
Characteristic
Polish cut for hard-to-cut materials such as SiC, Ceramics(LTCC) or composite materials Long-life blade The Cutting blade extends 10mm Easy alignment to cutting line Easy fixing of workpieces using cutting tape CSX-100 is suitable for small scale production as well
Other Products
-
Roll to Roll Automatic Printer
-
Ultrasonic Cleaning Machine
-
VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT (DOUBLE TYPE)
-
automatic vacuum packaging machine
-
Non-Woven Buff for Ti Drum
-
Exposure
-
Vertical pre-processing equipment
-
Kurabo BBMaster-8800
-
cables carriers, energy chains
-
cleanroom chain
Products you may be interested in
