Ultrasonic Cutting System for Cross-Section Observation
Model: Polish Cut System CSX-100 lab
Category: Others
Exhibitor: TechTrend Science Co., Ltd.
Booth No: TBA
Characteristic
Polish cut for hard-to-cut materials such as SiC, Ceramics(LTCC) or composite materials Long-life blade The Cutting blade extends 10mm Easy alignment to cutting line Easy fixing of workpieces using cutting tape CSX-100 is suitable for small scale production as well
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