Stencil Laser Equipment
Model: LPKF MicroCut 6080
Category: Routing Machine
Exhibitor: Microsys Engineering Co., Ltd.
Booth No: TBA
Characteristic
Advantages: 1. Cutting exact openings with a size of only 18 μm on the laser entry side and 10 μm on the exit side 2. The new benckmark for small apertures - Wafer stencils - Flux stencils - Filter applications - Highest precision, optimum results
Other Products
-
UPVC/CPVC SCH80 PIPLINE
-
CCL Laminating Vacuum Hot Press
-
Micromaterial processing with Laser Technology
-
Flip Chip AFVI
-
UV CURING MACHINE
-
LEAST PARTICLE P.P. SLITTING AND CUTTING MACHINE
-
Femtosecond Laser Hybrid Micro-fabrication System
-
Automatic Vision Inspection System(AVI)
-
Metal mask inspection system
-
Roll to Roll Dry Film Laminator
Products you may be interested in