LPKF Through-Glass Vias with Laser Precisions
Model: LPKF Vitrion 5000
Category: Routing Machine
Exhibitor: Microsys Engineering Co., Ltd.
Booth No: TBA
Characteristic
‧ Glass as interposer ‧ Efficient ultrafast laser process ‧ Up to 5 000 holes per second ‧ Standard production wafers
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