LPKF Through-Glass Vias with Laser Precisions

 

Model: LPKF Vitrion 5000

Category: Routing Machine

Exhibitor: Microsys Engineering Co., Ltd.

Booth No: TBA

 

Characteristic

 

‧ Glass as interposer ‧ Efficient ultrafast laser process ‧ Up to 5 000 holes per second ‧ Standard production wafers

 

Other Products

 

• 

  Chemical Pretreatment Line

• 

  Relay Module

• 

  TH/Via Filling

• 

  TFT-LCD CLEANING M/C

• 

  WICKET TYPE AUTO L.P.I CONVEYOR OVEN

• 

  AGV, RGV, MGV Automated Guided Vehicle Dust-Free Oxygen-Free Oven

• 

  Roll to Roll Automatic Punching Machine

• 

  Relay Module

• 

  REEL TO REEL VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT

• 

  Surface Mount Placement

 

 

 

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