LPKF Through-Glass Vias with Laser Precisions

 

Model: LPKF Vitrion 5000

Category: Routing Machine

Exhibitor: Microsys Engineering Co., Ltd.

Booth No: TBA

 

Characteristic

 

‧ Glass as interposer ‧ Efficient ultrafast laser process ‧ Up to 5 000 holes per second ‧ Standard production wafers

 

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