Hengfeng International Electronics
Area: 光电专区
Booth No: K-1018
Exhibitor Profile
Hengfeng International Electronics Co., Ltd. was founded in 2018 and is headquartered in Taichung, Taiwan. As a startup focused on infrared thermal imaging and optoelectronic integration, we offer the following customized services:
1. IR Imager module manufacturing and testing services
2. Detector options and core module manufacturing, including testing services
3. Customer product warranty, technical support, and training
The founding shareholders each have 25 years of experience in semiconductor packaging and camera module design. We specialize in the development, production, and customized solutions of infrared detector packaging and infrared camera modules.
With Taiwan as our R&D, design, and business service center, we hold numerous patents and operate a complete ceramic packaging production line. Our core expertise lies in ultra-high vacuum and ultra-high temperature applications.
Products and Services:
Customized infrared camera modules: QVGA/VGA/SXGA...
Infrared sensor pack
