R2R Copper/Nickel Metallized Polyimide Film

 

Model: R2R Copper/Nickel Metallized Polyimide Film

Category: Concductor Thickness

Exhibitor: TOP Nanometal Corporation

Booth No: TBA

 

Characteristic

 

Thin Cu/Ni Metallized Polyimide Film for EMI Shielding, Grounding and Flexible Electronics manufacturer | PI/PET base EMI shielding substrate or SMT conductive gasket materials TOP Nanometal Corp. is a Roll-to-Roll magnetron sputtering manufacturer, offering advanced R2R nickel or copper/nickel multilayer plating film technology. We provide high-uniformity, high-adhesion Nickel plating PI Film or PET Film, Copper and Nickel Metallized Polyimide Film, widely used in EMI shielding, conductive films, Flexible MEMS, electronic module protection and functional metal composite films. Our R2R production system supports customized thicknesses (nanometer to 3 micrometer) and also welcomes OEM/ODM projects. ◆Copper layer : Nanometer ~ 2um ◆Nickel layer : 0.5um ~ 3um ★【Standard Specifications】 (1) PI 25um+Ni 3 um (Surface resistivity:0.026Ω/□) (2) PI 25um+Cu 2 um + Ni 0.5um (Surface resistivity:0.013Ω/□)

 

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