Vertical Electroless Copper

Model: Printoganth MV TP2 / Printoganth PV

Category: Alkaline Palladium Base Electro-Less Copper Process

Booth No: TBA

Characteristic

‧ PrintoganthR MV TP2: provides superior throwing power with a low deposition thickness and an optimized deposition structure for fine lines and spaces of 10 μm and less. It ensures a uniform textured copper layer which is ideal for low loss applications and enhanced dry film adhesion, and even reduces operating costs due to low dummy plating requirements. ‧ Printoganth PV: enables blister-free copper deposition on a wide range of the most challenging base materials due to its unique internal stress characteristics. Combined with its outstanding reliability performance. Printoganth PV is a highly versatile, mass production proven electroless copper process for advanced MLB, HDI as well as flex/flex-rigid application.