Super Thin Copper Foil for IC substrate

 

Model: Super Thin Copper Foil for IC substrate

Category: Ultra Thin Copper Foil

Exhibitor: TOP Nanometal Corporation

Booth No: TBA

 

Characteristic

 

Super Thin copper foil with carrier is mainly used for IC Substrate which are formed by MSAP process. *Super Thin Copper Foil for IC substrate is 3um copper which covered with 18um copper foil. It is extremely easy to peel off once apply. *Suitable for mSAP semi-additive process, can be used as thin circuit substrate application. *The metal releasing layer + 3um electroforming copper is generated by physical production procedure on 18um copper foil substrate. *Suitable for IC Substrate, high-density interconnect technology boards, IC package process materials, etc.

 

Other Products

 

• 

  Three-machine printing automatic printing equipment for solder mask

• 

  Hitachi X-Ray Particle Contaminant Analyzer

• 

  Magnetic drive seal-less pump

• 

  LEAST PARTICLE P.P. SLITTING AND CUTTING MACHINE

• 

  SUPER CLEAN DRYER

• 

  Automatic slide grinding machine

• 

  TDR Impedance Testing Instrument

• 

  PCB (2D3D)/AVI inspection equipment

• 

  Microetch L

• 

  Digital Microscope with Laser-based Elemental Analyzer

 

 

Back